Taiwan supply-chain map 2026

Three supply chains — semiconductors, AI servers and tungsten — broken into links: which Taiwanese companies work in each and which link is supplied from abroad, with a source on every node.

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Semiconductors

From a licensable block of circuitry to a fully tested chip. Taiwan has companies in design, foundry, and packaging and testing; the most critical lithography machines and design software come from abroad.

  1. 1

    Silicon IP and design services

    Licensing ready-made circuit blocks to chip companies, or taking a customer's custom chip design through to tape-out

    • GUC（創意） 3443 ↗ Research, development, production, manufacturing, and sale of application-specific integrated circuits (embedded memory and logic components, design cell libraries, design automation tools), plus contracted technical services for customers
    • Alchip（世芯-KY） 3661 ↗ Design and manufacturing of highly complex, high-volume application-specific integrated circuits (ASIC) and systems-on-chip (SoC) developed for system companies
    • eMemory（力旺） 3529 ↗ Embedded non-volatile memory IP licensing and technical services
    • M31（M31） 6643 ↗ Silicon IP licensing fees and royalties (silicon IP licensing)

    Mainly supplied from abroad: EDA software used to design chips. GUC's annual report lists Cadence and Synopsys as silicon IP partners; none of the annual reports we reviewed list a Taiwan-based EDA supplier. ↗

  2. 2

    IC design

    Designing chips in-house and leaving manufacturing to others; the product sold is the designed chip

    • MediaTek（聯發科） 2454 ↗ Research, development, production, manufacturing, and sale of multimedia ICs, computer peripheral ICs, high-end consumer electronics ICs, and other application-specific ICs
    • RT（瑞昱） 2379 ↗ Research, development, production, manufacturing, and sale of various ICs, plus application design, testing, repair, and technical consulting on the hardware and software of IC products
    • NOVATEK（聯詠） 3034 ↗ Research, development, design, production, manufacturing, and sale of ICs and systems for voice, communications, embedded microcontrollers, digital signal processors, computer peripheral control, LCD drivers, and more
    • ASPEED（信驊） 5274 ↗ Multimedia ICs, computer peripheral ICs, high-end consumer electronics ICs
  3. 3

    Wafer materials

    Growing silicon into ingots and slicing them into wafers; chips are built on these discs

    • GWC（環球晶） 6488 ↗ Research, design, and manufacturing of semiconductor ingots and wafers
    • FST（台勝科） 3532 ↗ Manufacturing and sale of silicon wafer electronic materials
  4. 4

    Wafer foundry

    Taking customers' designs and manufacturing the chips on wafers

    • TSMC（台積電） 2330 ↗ Manufacturing and sale of ICs and other wafer-based semiconductor devices according to customer orders and the product designs they provide, plus packaging and testing services, photomask making, and design services
    • UMC（聯電） 2303 ↗ Wafer manufacturing services using advanced process technology, producing wafers for the IC industry's various applications
    • VIS（世界先進） 5347 ↗ Manufacturing and sale of ICs according to customer orders and the product designs they provide, plus packaging and testing services, photomask making, and design services
    • PSMC（力積電） 6770 ↗ Production, manufacturing, testing, and packaging of various ICs and their system products; repair, development, manufacturing, and sale of semiconductor equipment components; ASIC technology integration services and silicon IP design and services
  5. 5

    Memory

    Making chips that store data, such as DRAM and flash memory

  6. 6

    Equipment and facilities

    Building cleanrooms and fabs, making process equipment, and making the containers that carry wafers and photomasks

    • GPTC（弘塑） 3131 ↗ Engineering contracting, manufacturing, trading, and maintenance of semiconductor and IC manufacturing equipment; wet-process chemicals; semiconductor-related mechanical installation and electronic component manufacturing
    • Gudeng（家登） 3680 ↗ Photomask solutions, wafer solutions, and machine equipment products
    • MIC（帆宣） 6196 ↗ Sales and services of high-tech equipment and materials, customized equipment development and manufacturing, facility automation and integrated systems
    • UIS（漢唐） 2404 ↗ Turnkey construction of advanced semiconductor manufacturing and packaging facilities, including cleanrooms, controls, and mechanical and electrical work, and renovation projects with clients to upgrade their processes
    • Fiti（京鼎） 3413 ↗ Semiconductor equipment, subsystems, and system integration; flat-panel display equipment, subsystems, and system integration

    Mainly supplied from abroad: Extreme ultraviolet (EUV) lithography machines. ASML's website states that only it has this technology; it is headquartered in the Netherlands. The Taiwan companies listed in this stage make wet-process equipment, facility engineering, and carriers for wafers and photomasks. ↗

  7. 7

    Packaging and testing

    Cutting the wafer apart, packaging individual chips, and testing them before shipment

    • ASEH（日月光投控） 3711 ↗ Packaging and module design, IC packaging, multi-chip packaging, memory packaging; front-end testing, wafer probing, final testing; substrate design and manufacturing
    • PTI（力成） 6239 ↗ Integrated circuit (IC) packaging and testing
    • KYEC（京元電子） 2449 ↗ Design, manufacturing, testing, accessories, processing, packaging, and sale of various ICs
    • SIGURD（矽格） 6257 ↗ Design, processing, testing, packaging, and burn-in manufacturing and trading of various ICs; testing services for various ICs and wafers
  8. 8

    Test interfaces

    Probe cards, test sockets, and test boards that sit between the chip and the tester during chip testing

    • WinWay（穎崴） 6515 ↗ Semiconductor test interfaces, precision pogo pins, probe cards, temperature control modules
    • MPI（旺矽） 6223 ↗ Processing, repair, and manufacturing of semiconductor test components; revenue comes mainly from sales of wafer probe cards and semiconductor equipment
    • CHPT（精測） 6510 ↗ Wafer test cards and technical services for IC test boards
Data table
Link Company What it does in this link HQ
1. Silicon IP and design services GUC（創意） （3443） Research, development, production, manufacturing, and sale of application-specific integrated circuits (embedded memory and logic components, design cell libraries, design automation tools), plus contracted technical services for customers Hsinchu City
1. Silicon IP and design services Alchip（世芯-KY） （3661） Design and manufacturing of highly complex, high-volume application-specific integrated circuits (ASIC) and systems-on-chip (SoC) developed for system companies Taipei
1. Silicon IP and design services eMemory（力旺） （3529） Embedded non-volatile memory IP licensing and technical services Hsinchu City
1. Silicon IP and design services M31（M31） （6643） Silicon IP licensing fees and royalties (silicon IP licensing) Hsinchu County
2. IC design MediaTek（聯發科） （2454） Research, development, production, manufacturing, and sale of multimedia ICs, computer peripheral ICs, high-end consumer electronics ICs, and other application-specific ICs Hsinchu City
2. IC design RT（瑞昱） （2379） Research, development, production, manufacturing, and sale of various ICs, plus application design, testing, repair, and technical consulting on the hardware and software of IC products Hsinchu County
2. IC design NOVATEK（聯詠） （3034） Research, development, design, production, manufacturing, and sale of ICs and systems for voice, communications, embedded microcontrollers, digital signal processors, computer peripheral control, LCD drivers, and more Hsinchu County
2. IC design ASPEED（信驊） （5274） Multimedia ICs, computer peripheral ICs, high-end consumer electronics ICs Hsinchu City
3. Wafer materials GWC（環球晶） （6488） Research, design, and manufacturing of semiconductor ingots and wafers Hsinchu City
3. Wafer materials FST（台勝科） （3532） Manufacturing and sale of silicon wafer electronic materials Yunlin
4. Wafer foundry TSMC（台積電） （2330） Manufacturing and sale of ICs and other wafer-based semiconductor devices according to customer orders and the product designs they provide, plus packaging and testing services, photomask making, and design services Hsinchu City
4. Wafer foundry UMC（聯電） （2303） Wafer manufacturing services using advanced process technology, producing wafers for the IC industry's various applications Hsinchu City
4. Wafer foundry VIS（世界先進） （5347） Manufacturing and sale of ICs according to customer orders and the product designs they provide, plus packaging and testing services, photomask making, and design services Hsinchu County
4. Wafer foundry PSMC（力積電） （6770） Production, manufacturing, testing, and packaging of various ICs and their system products; repair, development, manufacturing, and sale of semiconductor equipment components; ASIC technology integration services and silicon IP design and services Hsinchu City
5. Memory NTC（南亞科） （2408） Focused on memory products; main products are DRAM chips (DDR2 to DDR5, LPDDR, and others) New Taipei
5. Memory WEC（華邦電） （2344） Main products are flash memory (code storage flash memory) and customized memory solutions Taichung
6. Equipment and facilities GPTC（弘塑） （3131） Engineering contracting, manufacturing, trading, and maintenance of semiconductor and IC manufacturing equipment; wet-process chemicals; semiconductor-related mechanical installation and electronic component manufacturing Hsinchu City
6. Equipment and facilities Gudeng（家登） （3680） Photomask solutions, wafer solutions, and machine equipment products New Taipei
6. Equipment and facilities MIC（帆宣） （6196） Sales and services of high-tech equipment and materials, customized equipment development and manufacturing, facility automation and integrated systems Taipei
6. Equipment and facilities UIS（漢唐） （2404） Turnkey construction of advanced semiconductor manufacturing and packaging facilities, including cleanrooms, controls, and mechanical and electrical work, and renovation projects with clients to upgrade their processes New Taipei
6. Equipment and facilities Fiti（京鼎） （3413） Semiconductor equipment, subsystems, and system integration; flat-panel display equipment, subsystems, and system integration Miaoli
7. Packaging and testing ASEH（日月光投控） （3711） Packaging and module design, IC packaging, multi-chip packaging, memory packaging; front-end testing, wafer probing, final testing; substrate design and manufacturing Kaohsiung
7. Packaging and testing PTI（力成） （6239） Integrated circuit (IC) packaging and testing Hsinchu County
7. Packaging and testing KYEC（京元電子） （2449） Design, manufacturing, testing, accessories, processing, packaging, and sale of various ICs Hsinchu City
7. Packaging and testing SIGURD（矽格） （6257） Design, processing, testing, packaging, and burn-in manufacturing and trading of various ICs; testing services for various ICs and wafers Hsinchu County
8. Test interfaces WinWay（穎崴） （6515） Semiconductor test interfaces, precision pogo pins, probe cards, temperature control modules Kaohsiung
8. Test interfaces MPI（旺矽） （6223） Processing, repair, and manufacturing of semiconductor test components; revenue comes mainly from sales of wafer probe cards and semiconductor equipment Hsinchu County
8. Test interfaces CHPT（精測） （6510） Wafer test cards and technical services for IC test boards Taoyuan

AI servers

After the chips are made, they need substrates, cooling, power, chassis, and cabling, and are finally assembled into full server racks. Most stages of this chain are in Taiwan; GPU design and high-bandwidth memory are abroad.

  1. 1

    GPU/ASIC design services

    Someone has to design AI accelerators; Taiwan companies take on custom ASIC design-to-volume-production services

    • Alchip（世芯-KY） 3661 ↗ Design and manufacturing of highly complex, high-volume application-specific integrated circuits (ASIC) and systems-on-chip (SoC) developed for system companies
    • GUC（創意） 3443 ↗ Research, development, production, manufacturing, and sale of application-specific integrated circuits (embedded memory and logic components, design cell libraries, design automation tools), plus contracted technical services for customers

    Mainly supplied from abroad: The architecture of general-purpose GPUs is designed by companies such as NVIDIA and AMD. What Taiwanese companies do in this link is design services for custom chips.

  2. 2

    Wafer foundry and advanced packaging

    AI chips are first made in a wafer fab, then packaged onto the same substrate as high-bandwidth memory

    • TSMC（台積電） 2330 ↗ Manufacturing of ICs according to customer orders; CoWoS advanced packaging service integrating multiple systems-on-chip (SoC) with high-bandwidth memory (HBM)
    • ASEH（日月光投控） 3711 ↗ Packaging and module design, IC packaging, multi-chip packaging, memory packaging; front-end testing, wafer probing, final testing; substrate design and manufacturing

    Mainly supplied from abroad: High-bandwidth memory (HBM). A 2022 SK hynix press release says its HBM3 is used in NVIDIA’s H100. ↗

  3. 3

    ABF substrates, PCBs, and copper-clad laminates

    Chips are mounted on substrates, and server motherboards are multilayer circuit boards; one raw material for both is copper-clad laminate

    • UNIMICRON（欣興） 3037 ↗ Development, manufacturing, processing, and sale of printed circuit boards (PCB), high-density interconnect boards (HDI), flexible boards, rigid-flex boards, and IC carriers
    • KINSUS（景碩） 3189 ↗ Manufacturing and sale of IC substrates: PBGA substrates, flip-chip substrates, and others
    • N.P.C（南電） 8046 ↗ Production and sale of conventional printed circuit boards, HDI, rigid-flex boards, ABF substrates, and PP substrates
    • EMC（台光電） 2383 ↗ Manufacturing, processing, and sale of copper-clad laminates for printed circuit boards, inner-layer copper-clad laminates, prepreg, and multilayer laminates
    • GCE（金像電） 2368 ↗ Printed circuit boards (for communications and computer-related products, including server boards for AI and cloud use)
  4. 4

    Cooling

    AI servers consume a lot of power, so fans, thermal modules, or liquid cooling are needed to carry the heat away

    • AVC（奇鋐） 3017 ↗ Thermal products (fans, heat sinks, thermal modules, heat exchangers, heat pipes/vapor chambers, and liquid cooling solutions such as cold plates), chassis and cabinets, system assembly, and hinges
    • AURAS（雙鴻） 3324 ↗ Thermal modules
  5. 5

    Power

    Converting mains electricity into power that servers and chips can use

    • DELTA（台達電） 2308 ↗ Power supply systems, brushless DC fans, thermal systems, and more; in recent years focused on AI data centers, microgrids, smart manufacturing, smart buildings, and green transportation
    • LTC（光寶科） 2301 ↗ Design, development, production, and sale of products for data centers, servers, networking equipment, AI, and IoT, including server power supplies and energy storage system solutions
  6. 6

    Chassis and slide rails

    The metal enclosure of the server, and the slide rails that let servers be pulled in and out of the rack

    • CHENBRO（勤誠） 8210 ↗ Research, development, manufacturing, processing, and trading of server chassis and components, and desktop and industrial PC chassis
    • king slide（川湖） 2059 ↗ Research, design, manufacturing, and sale of rails and server peripheral components; slide rails for various uses; concealed hinges
  7. 7

    Cables and connectors

    The cables, sockets, and connectors inside and outside the server

    • BHI (BizLink)（貿聯-KY） 3665 ↗ Cables, wire harnesses, and connection modules and system solutions for markets including industrial automation, information technology and data centers, automotive, and medical
    • LOTES（嘉澤） 3533 ↗ Design, manufacturing, and sale of connectors, cables, sockets, and related components for servers, personal computers, automotive, industrial control, and medical applications
  8. 8

    Complete system and rack assembly (ODM)

    Assembling boards, cooling, and power into whole servers or racks and delivering them to cloud providers

    • HON HAI（鴻海） 2317 ↗ Cloud networking, consumer intelligence, computer terminals, components, and other products; vertical integration of AI servers from design, key components, and modules to liquid cooling systems and complete system assembly
    • QCI（廣達） 2382 ↗ Research, design, and manufacturing of servers, notebook computers, automotive electronics, and other consumer electronics (mainly for export)
    • Wistron（緯創） 3231 ↗ Research, development, design, production, manufacturing, testing, and after-sales service of servers, workstations, AI computing equipment, high-performance multi-CPU computer systems and their key components, as well as PCs, notebooks, and mobile phones
    • Wiwynn（緯穎） 6669 ↗ Cloud computing infrastructure solutions: computing and storage equipment and system integration for hyperscale data centers
    • INVENTEC（英業達） 2356 ↗ Production and sale of computer and smart terminal products; enterprise solutions including servers, storage equipment, switches, artificial intelligence solutions, and rack solutions
Data table
Link Company What it does in this link HQ
1. GPU/ASIC design services Alchip（世芯-KY） （3661） Design and manufacturing of highly complex, high-volume application-specific integrated circuits (ASIC) and systems-on-chip (SoC) developed for system companies Taipei
1. GPU/ASIC design services GUC（創意） （3443） Research, development, production, manufacturing, and sale of application-specific integrated circuits (embedded memory and logic components, design cell libraries, design automation tools), plus contracted technical services for customers Hsinchu City
2. Wafer foundry and advanced packaging TSMC（台積電） （2330） Manufacturing of ICs according to customer orders; CoWoS advanced packaging service integrating multiple systems-on-chip (SoC) with high-bandwidth memory (HBM) Hsinchu City
2. Wafer foundry and advanced packaging ASEH（日月光投控） （3711） Packaging and module design, IC packaging, multi-chip packaging, memory packaging; front-end testing, wafer probing, final testing; substrate design and manufacturing Kaohsiung
3. ABF substrates, PCBs, and copper-clad laminates UNIMICRON（欣興） （3037） Development, manufacturing, processing, and sale of printed circuit boards (PCB), high-density interconnect boards (HDI), flexible boards, rigid-flex boards, and IC carriers Taoyuan
3. ABF substrates, PCBs, and copper-clad laminates KINSUS（景碩） （3189） Manufacturing and sale of IC substrates: PBGA substrates, flip-chip substrates, and others Taoyuan
3. ABF substrates, PCBs, and copper-clad laminates N.P.C（南電） （8046） Production and sale of conventional printed circuit boards, HDI, rigid-flex boards, ABF substrates, and PP substrates Taipei
3. ABF substrates, PCBs, and copper-clad laminates EMC（台光電） （2383） Manufacturing, processing, and sale of copper-clad laminates for printed circuit boards, inner-layer copper-clad laminates, prepreg, and multilayer laminates Taoyuan
3. ABF substrates, PCBs, and copper-clad laminates GCE（金像電） （2368） Printed circuit boards (for communications and computer-related products, including server boards for AI and cloud use) Taoyuan
4. Cooling AVC（奇鋐） （3017） Thermal products (fans, heat sinks, thermal modules, heat exchangers, heat pipes/vapor chambers, and liquid cooling solutions such as cold plates), chassis and cabinets, system assembly, and hinges Kaohsiung
4. Cooling AURAS（雙鴻） （3324） Thermal modules New Taipei
5. Power DELTA（台達電） （2308） Power supply systems, brushless DC fans, thermal systems, and more; in recent years focused on AI data centers, microgrids, smart manufacturing, smart buildings, and green transportation Taoyuan
5. Power LTC（光寶科） （2301） Design, development, production, and sale of products for data centers, servers, networking equipment, AI, and IoT, including server power supplies and energy storage system solutions Taipei
6. Chassis and slide rails CHENBRO（勤誠） （8210） Research, development, manufacturing, processing, and trading of server chassis and components, and desktop and industrial PC chassis New Taipei
6. Chassis and slide rails king slide（川湖） （2059） Research, design, manufacturing, and sale of rails and server peripheral components; slide rails for various uses; concealed hinges Kaohsiung
7. Cables and connectors BHI (BizLink)（貿聯-KY） （3665） Cables, wire harnesses, and connection modules and system solutions for markets including industrial automation, information technology and data centers, automotive, and medical New Taipei
7. Cables and connectors LOTES（嘉澤） （3533） Design, manufacturing, and sale of connectors, cables, sockets, and related components for servers, personal computers, automotive, industrial control, and medical applications Keelung
8. Complete system and rack assembly (ODM) HON HAI（鴻海） （2317） Cloud networking, consumer intelligence, computer terminals, components, and other products; vertical integration of AI servers from design, key components, and modules to liquid cooling systems and complete system assembly New Taipei
8. Complete system and rack assembly (ODM) QCI（廣達） （2382） Research, design, and manufacturing of servers, notebook computers, automotive electronics, and other consumer electronics (mainly for export) Taoyuan
8. Complete system and rack assembly (ODM) Wistron（緯創） （3231） Research, development, design, production, manufacturing, testing, and after-sales service of servers, workstations, AI computing equipment, high-performance multi-CPU computer systems and their key components, as well as PCs, notebooks, and mobile phones Hsinchu County
8. Complete system and rack assembly (ODM) Wiwynn（緯穎） （6669） Cloud computing infrastructure solutions: computing and storage equipment and system integration for hyperscale data centers New Taipei
8. Complete system and rack assembly (ODM) INVENTEC（英業達） （2356） Production and sale of computer and smart terminal products; enterprise solutions including servers, storage equipment, switches, artificial intelligence solutions, and rack solutions Taipei

Tungsten

Tungsten is used in cutting tools and also in chip manufacturing. In this chain, Taiwan has recycling and refining plus downstream processing. The US Geological Survey estimates global mine production in 2025 at 85,000 tonnes, of which China accounted for 67,000 tonnes; since February 2025, China has imposed export controls on tungsten-related items.

  1. 1

    Tungsten ore and concentrate (mining)

    Digging tungsten-bearing ore out of mines and beneficiating it into concentrate; the furthest upstream stage of the chain

    No Taiwanese company is listed for this link.

    Mainly supplied from abroad: Tungsten mining. The US Geological Survey's 2026 edition statistics: estimated global mine production in 2025 was 85,000 tonnes, of which China accounted for 67,000 tonnes. For this stage we found no official data on any Taiwan company. ↗

  2. 2

    Recycling and refining: sodium tungstate, APT, tungsten oxide

    Leaching tungsten from scrap cemented carbide and cutting swarf, purifying it, and making the tungsten compounds that downstream users need

    • LIANYOU METALS（聯友金屬） 7610 ↗ Using secondary cemented carbide and secondary tungsten and cobalt resources as raw materials, reducing them to tungsten and cobalt metal materials; current main products are sodium tungstate and cobalt sulfate solution
    • 京沅鎢鈷資源 ↗ Reprocessing recycled tungsten-bearing scrap, secondary tungsten powder, secondary alloys, sodium tungstate, and calcium tungstate into ammonium paratungstate (APT), tungsten oxide, and cobalt carbonate
  3. 3

    Tungsten powder and tungsten carbide powder

    Reducing tungsten oxide to tungsten powder, then combining it with carbon into tungsten carbide powder, the raw material for cemented carbide

    • LIANYOU METALS（聯友金屬） 7610 ↗ Tungsten carbide processing and smelting is listed among the company’s products; its main current products remain sodium tungstate and cobalt sulphate solution
    • 京沅鎢鈷資源 ↗ Plans to produce tungsten powder and tungsten carbide powder; its website describes this as an investment plan under preparation, not an existing product
  4. 4

    Cemented carbide cutting tools

    Pressing and sintering tungsten carbide powder with cobalt, then grinding it into turning tools, milling cutters, and drill bits, used in machine tools and in electronic component machining

    • 萬事達切削科技 ↗ Manufacturing cutting tools by pressing, sintering, grinding, and coating
  5. 5

    Tungsten hexafluoride (WF6) for semiconductors

    A gas used in chip manufacturing to deposit tungsten, layer by layer, into the contact holes of a chip

    No Taiwanese company is listed for this link.

    Mainly supplied from abroad: We found no official documents on whether any Taiwan company produces this, so none is listed.

  6. 6

    Tungsten sputtering targets

    Metal targets used in sputtering processes, of which tungsten is one material

    • Solar（光洋科） 1785 ↗ Manufacturing of thin-film sputtering targets and evaporation materials; one of the main raw materials of thin-film sputtering materials is tungsten
Data table
Link Company What it does in this link HQ
2. Recycling and refining: sodium tungstate, APT, tungsten oxide LIANYOU METALS（聯友金屬） （7610） Using secondary cemented carbide and secondary tungsten and cobalt resources as raw materials, reducing them to tungsten and cobalt metal materials; current main products are sodium tungstate and cobalt sulfate solution Pingtung
2. Recycling and refining: sodium tungstate, APT, tungsten oxide 京沅鎢鈷資源 Reprocessing recycled tungsten-bearing scrap, secondary tungsten powder, secondary alloys, sodium tungstate, and calcium tungstate into ammonium paratungstate (APT), tungsten oxide, and cobalt carbonate Pingtung
3. Tungsten powder and tungsten carbide powder LIANYOU METALS（聯友金屬） （7610） Tungsten carbide processing and smelting is listed among the company’s products; its main current products remain sodium tungstate and cobalt sulphate solution Pingtung
3. Tungsten powder and tungsten carbide powder 京沅鎢鈷資源 Plans to produce tungsten powder and tungsten carbide powder; its website describes this as an investment plan under preparation, not an existing product Pingtung
4. Cemented carbide cutting tools 萬事達切削科技 Manufacturing cutting tools by pressing, sintering, grinding, and coating Tainan
6. Tungsten sputtering targets Solar（光洋科） （1785） Manufacturing of thin-film sputtering targets and evaporation materials; one of the main raw materials of thin-film sputtering materials is tungsten Tainan

Node sources accessed: 2026-11-10

The companies and roles on this map are compiled from public information and are used only to describe supply-chain structure. Being listed is not a recommendation, and not being listed does not mean a company is unimportant. Taiwan.md does not rate individual stocks or forecast prices; nothing here is investment advice.

How do I read the result?

Each chain runs from upstream on the left to downstream on the right. One card is one link: the first line says what the link does, followed by the Taiwanese companies in it and what each does. A dashed box says where the link depends mainly on foreign suppliers. Underlined company names lead to that company’s row in the market-cap ranking or to an article on this site.

How is a company assigned to a link?

Each company is placed according to the business overview in its annual report, its website, or the principal business registered on the Market Observation Post System. The arrow beside a node leads to that source.

Many companies span several links; only the main one is shown. Each link lists at most five companies and is not a complete roster. Market shares and rankings are omitted because such figures mostly come from paid market-research reports whose originals we cannot check. Only three chains have been drawn; bicycles, machine tools, display panels and offshore wind are still to come.

Where does the data come from?

Company roles: each company’s 2025 annual report (TWSE Market Observation Post System) and website. Foreign suppliers: ASML’s website and an SK hynix press release. Tungsten: US Geological Survey Mineral Commodity Summaries 2026 and China’s Ministry of Commerce Announcement No. 10 of 2025. Accessed 2026-11-10.

Frequently asked questions

Where does TSMC sit in the supply chain?

In foundry: it manufactures chips on wafers to its customers’ designs. It also does advanced packaging, its annual report says the CoWoS service integrates multiple systems-on-chip with high-bandwidth memory, so it appears once more on the AI-server chain.

What are the links in the AI-server supply chain?

This map uses eight: chip design services, foundry and advanced packaging, substrates and circuit boards, cooling, power, chassis and rails, cables and connectors, and system and rack assembly.

Which links of the semiconductor chain does Taiwan lack?

Two that we can source: extreme-ultraviolet lithography machines come from ASML in the Netherlands, and for the EDA software used to design chips the annual reports name Cadence and Synopsys.

Why are there no market shares or rankings?

Market-share figures mostly come from paid research reports whose originals we cannot verify. The map shows only what each company says about its own business in its annual report or on its website.

What does tungsten have to do with semiconductors?

As tungsten hexafluoride gas and sputtering targets it is used in chip manufacturing; as tungsten carbide it is the material of cutting tools. China has applied export controls to tungsten-related items since February 2025.

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